Electronic Glossary
Many electronics glossary, like terms, abbreviations, or technical words, you hear mean something to you already, and others will have you wondering. This list, covering printed circuit board (PCB), electronics, semiconductors, component packages, is far from complete, but should cover most of the more common glossary, and hopefully in a meaningful way.
Choose an Alphabet to select the electronics glossary you want.
A
- AC
- AC Coupling
- AC Voltage
- AC/DC
- Active Components
- Additive Process
- AF
- AI
- AIAG
- AIDC
- Alternating Current
- AM
- Ambient
- Ampere
- Amplifier
- Amplitude
- Amplitude Modulation
- Analog
- Analog Circuit
- Analog Signal
- Anode
- ANSI
- Antipad
- Aperture
- APQP
- AQL
- Arduino
- Artwork
- Artwork Master
- ASCII
- ASIC
- Aspect Ratio
- Assembly Drawing
- Assembly House
- ATE
- Autoplacement
- Autorouter
- Autotransformer
- AWG
- Axial Lead
B
- B-Stage
- Backplane
- Band-Pass Filter
- Band-Stop Filter
- Bandwidth
- Barcode
- Bare Board
- Barrel
- Battery
- Baud
- BBT
- Beam Lead
- Bed of Nails
- BeiDou
- Bend Radius
- Beveled Edge
- Beveling
- BGA
- Bias
- BIN
- BIN File
- Binary
- Binary Alloy
- Binary Code
- Bipolar Junction Transistor
- BJT
- BL
- Black Pad
- Blister
- Bluetooth
- Board
- Board House
- Board Thickness
- Board Vendor
- Body Gold
- BOM
- Bond Strength
- Bondply
- Boolean Logic
- Border Area
- Bow
- BQFP
- Breakdown Voltage
- Breakout
- Breakover Voltage
- Bridge Rectifier
- Buffer
- Buildup
- Built-In Self Test
- Burr
- Bus
- Butt Joint
- Byte
C
- C-Stage Resin
- CAD
- CAE
- CAF
- Calibration
- CAM
- CAM Files
- Capacitance
- Capacitor
- Capture
- Card
- Card Edge Connector
- Cathode
- CBGA
- CCGA
- CCR
- CDIP
- CEM-1 / CEM-3
- Ceramic Capacitor
- Ceramic PCB
- CERDIP
- CERPACK
- CERQUAD
- CFP
- CGA
- Chamfer
- Characteristic Impedance
- Check Plots
- Chip
- Chip Carrier
- Chip Package
- Circuit Breaker
- Circuit Diagram
- Circuitry Layer
- CLCC
- Cleanroom
- Clearance Hole
- Clearances
- Clock
- Closed Circuit
- CMOS
- CNC
- Coaxial Cable
- COB
- COF
- COG
- Cold Spot
- Collector
- Color Code
- Common Cathode Display
- Common-Anode Display
- Comparator
- Component
- Component Hole
- Component Library
- Component Mounting Orientation
- Component Side
- Conductive Adhesive
- Conductive Pattern
- Conductor
- Conductor Spacing
- Conductor Thickness
- Conflict Minerals
- Conformal Coating
- Connectivity
- Connector
- Connector Tongue
- Constant Current Circuit
- Contact
- Contact Angle
- Contract Manufacturer
- Controlled Dielectric
- Convection/IR
- Conveyor
- COP
- Copacker
- Coplanar
- Coplanarity
- Copper Pour
- Copper Weight
- Core
- Core Thickness
- Corrosion
- Corrosive Flux
- Counterbore
- Countersink
- Coupling
- CPGA
- CPU
- CQFP
- Crosshatching
- Crosstalk
- Crystal
- Crystal Oscillator
- CSOP
- CSP
- CTE
- CTI
- Curing
- Curing Time
- Current
- Cut-outs
- Cut-Tape
- Cutoff
- Cycle
D
- D-Code
- D2PAK
- D3PAK
- DAC
- Date Code
- Datum
- DBC
- DC
- DC Power Supply
- Deburring
- Decade
- Decal
- Decibel
- Defect
- Delamination
- Delivery Format
- Desmear
- Desoldering
- Develop
- Device
- Df
- DFN
- DIAC
- Die
- Die Bonding
- Dielectric
- Dielectric Constant
- Differential Amplifier
- Differential Signal
- Digital
- Digital Circuit
- Digital Signal
- Dimensional Stability
- Dimensioned Hole
- Dimple
- Diode
- DIP
- Direct Coupling
- Direct Current
- Discharge
- Discrete Component
- Discrete Components
- Discrete Logic
- DLCC
- Double-Sided Assembly
- Double-Track
- DPAK
- DPC
- DRAM
- DRC
- Drill File
- Dry Film Solder Mask (DFSM)
- DSBGA
- DSOP Advance
- DSP
- Dual In-Line
- Dummy Traces
- DUT
- DXF
E
- ECIA
- ECL
- ECM
- ECO Efficiency
- ED Copper
- EDA, ECAD
- Eddy Current
- Edge Clearance
- Edge Connector
- EDI
- EEPROM
- EIA
- Electric Polarization
- Electrical Strength
- Electrical Waveforms
- Electro Deposition
- Electro-less Gold Plating
- Electroless Deposition
- Electrolytic Capacitor
- Electromagnet
- Electromagnetic Radiation (EMR)
- Electromagnetic Waves
- Electromechanical Components
- Electron
- Electron Flow
- Electroplating
- Embedded
- EMC
- EMI
- EMIC
- Emitter
- EMS
- Enclosure
- ENEPIG
- Enhancement-mode MOSFET
- ENIG
- Epoxy Resin
- Epoxy Smear
- EPROM
- ESD
- Etch Back
- Etch Compensation
- Etch Factor
- Etchback
- Etching
- Ethernet
- ETQFP
- Eutectic
- eWLB
- Excellon Format
- Extra Press Cycles
F
- Fab
- Fab Drawing
- Fab Notes
- Fabrication Drawing
- FAI
- Farad
- FBGA
- FCPGA
- FCT
- Feed-Thru VIA
- Ferrite
- Ferrite Bead
- Ferrite-Core Inductor
- Ferrites
- FET
- FET Biasing
- FFC
- FI-WLP, FO-WLP
- Fiberglass
- Fill Area
- Fillet
- Filter
- Fine Line
- Fine Pitch
- Finished Copper
- Firmware
- First Article
- Flash Gold
- Flash Memory
- Flatpack
- Flip Chips
- Flip Flop
- Floating-gate MOSFET
- Flow Soldering
- Flux
- FM
- FMEA
- Footprint
- Forward Bias
- FPGA
- FR-4
- FR-5
- FR-6
- Frequency
- Frequency Modulation
- Full Wave Rectifier
- Function Generator
- Functional Test
- Fuse
H
I
K
L
- Laminate
- Laminate Thickness
- Laminate Void
- Laminating Press
- Lamination
- LAN
- Land
- Land pattern
- Landless Hole
- Laser
- Laser Ablation
- Laser Drilling
- Laser Photoplotter
- Layer-to-Layer Spacing
- Layers
- LBGA
- LCC
- LCCC
- LDI
- Lead
- Lead Span
- Leadless Chip Carrier
- Leadless Surface Mount Components
- Leakage
- Leakage Current
- LED
- Legend
- LFBGA
- LGA
- Life Cycle Assessment
- Line
- Line Regulation
- Linear
- Lithography
- LLP
- Load
- Load Current
- Load Impedance
- Load Regulation
- Logic
- Logic Circuits
- Logic Device
- Logic Gate
- Loose and Bulk
- Loss Tangent
- Lot
- Lot Code
- Low Insertion Force
- Low-pass Filter
- LPI
- LQFP
- LVDS
M
- Major Defect
- Manufacturability
- MAP-BGA
- Master Pattern
- Maxwell (unit)
- MCM
- MCM-L
- MCU
- MDIP
- Measling
- Measlling
- MELF
- Metal Film Resistor
- Metal Oxide Resistor
- MG 8330 Silver Conductive Epoxy
- MIC
- Mica Capacitor
- Micro BGA (μBGA)
- Micro Circuits
- micro SMD
- Micro SMDxt
- Micro-Sectioning
- Microphone
- Microsection
- Microstrip
- Microwave
- Mil
- mini-SOIC
- Minimum Conductor Clearance
- Minimum Conductor Width
- Minor Defect
- Mixed Technology
- MLP
- Modulation
- Moisture Absorption
- MOSFET
- Motherboard
- Mouse Bites
- MQFP
- MSOP
- MTBF
- Multi Segment Display
- Multimeter
- Mutual Inductance
N
O
P
- P-N Junction
- PAC
- Pad
- Pad Fillets
- Pad Size
- Panel Plating
- Panelization, Panel, Frame, Fiducials, Tooling Holes
- Parallel Circuit
- Part
- Part Number
- Passive Components
- Pattern
- Pattern Plating
- PBGA
- PC Board
- PC Card
- PCA
- PCB
- PCB Antenna
- PCB Database
- PCB Loader
- PCBA
- PCI
- PCI Express
- PCI-X
- PCMCIA
- PCMCIA
- PDIP
- Peak Inverse Voltage (PIV)
- Peak to Peak
- PEC
- Peel Strength
- Peelable Solder Mask
- Period
- PFMEA
- PGA
- Phase
- Phase Angle
- Phase Shift
- Phase Shift Oscillator
- Phosphor
- Photo Detector
- Photo Print
- Photoconductive Cell
- Photoconductivity
- Photodiode
- Photon
- Photoplotter
- Photoresist
- Photoresistor
- Phototool
- Pick and Place
- Piezoelectric Crystal
- Piezoelectric Effect
- Pin
- Pitch
- Plane
- Plasma Etching
- Plastic Film Capacitor
- Plastic Leaded Chip Carrier
- Plating
- Plating Resist
- PLC
- PLCC
- PMCP
- PNP Transistor
- Pogo Pin
- Polarity
- Polarized
- Polygons
- Polyimide
- POP
- Positive
- Potential Difference
- Potential Energy
- Potentiometer
- Power
- Power Amplifier
- Power Density
- Power Dissipation
- PPAP
- PPGA
- PQFN
- PQFP
- Press-Fit
- Primary
- Printed Circuit Board
- Processor
- Product Life Cycle
- PROM
- Propagation Delay
- Prototype
- Prototyping
- PSON
- PSOP
- PTFE
- Pulse
- PVD
- PWB
R
- RA Copper
- Radar
- Radial Lead
- RAM
- Raspberry Pi
- Reactance
- Reactive Power
- Receiver
- Recovery
- Rectification
- Rectifier
- Recycling
- Reference Designator
- Reflection
- Reflow Oven
- Registration
- Regulated Power Supply
- Regulator
- Reinforcement
- Relaxation Oscillator
- Relay
- Reliability
- Reluctance
- Repair
- Residue
- Resist
- Resistance
- Resistive Power
- Resistor
- Resistor Color Code
- Resonance
- Resonator
- Resputtering
- Reverse Bias
- RF
- RF Filters
- RFID
- Rheostat
- Rigid PCB
- RL Filter
- RL Integrator
- RMS Value
- Robber
- ROI
- ROM
- Rotary Switch
- Rough Holes
- Rout
- Route (or Track)
- Route and Retain
- Router
- RTF
S
- Saturation
- Saw Tooth Wave
- SBC
- SBDIP
- SBGA
- SBU
- Schematic
- Schematic Capture
- Schematic Diagram
- Schmitt Trigger
- Schottky Diode
- SCR
- Screen Printing
- SCS
- SDIP
- SDRAM
- Secondary
- Selective Gold
- Self Alignment
- Semiconductor
- Sequencing
- Sequential Lamination
- Series Circuit
- Seven Segment Display
- Shadowing
- Shear Strength
- Shear Thinning
- Sheet Resistance
- Shield
- Short
- Signal
- Signal layer
- Signal Loss
- Silicon
- Silicon Transistor
- Silver Mica Capacitor
- Single Throw Switch
- Single Track
- Sinusoidal
- SIP
- SIR
- SKDIP
- Skew
- Skin Effect
- SMD
- SMD Packages
- SMOBC
- SMT Feeder
- SoC
- Soft Gold
- SOIC
- SOJ
- Solder Balls
- Solder Bridging
- Solder Bump
- Solder Coat
- Solder Fillet
- Solder Leveling
- Solder Mask Dam
- Solder Paste
- Solder Paste Layer
- Solder Side
- Solder Webbing
- Solder Wick
- Solder Wicking
- Solderability Test
- Soldering
- Solids Content
- SON
- SOP
- SOT
- SOT-23
- Space Transformer
- SPDIP
- SPDT
- SPST
- Sputter Deposition
- Sputtering
- SQFP
- Square Wave
- SRAM
- SSD
- SSOP
- Stackup
- Stencil
- Step and Repeat
- Step Down Transformer
- Step Up Transformer
- Strain Relief
- Stripline
- Stuff
- Subcontractor
- Substrate
- Supply Voltage
- Surface Resistivity
- Surface Roughness
- Sweep
- Switch
- Switching Transistor
- Symbol
- System-in-Package (SiP)
T
- T260
- T288
- TAB
- Tab Rout
- Tantalum Capacitor
- Tape and Reel
- TBGA
- TCSP
- Td (Decomposition Temperature)
- TDFN
- TDR
- TDR Testing
- TDSP
- Teardrop
- Temperature Coefficient (TC)
- Tensile Strength
- Tented Via
- TEPBGA
- Terminal
- Test Coupon
- Test Pad
- Test Point
- Testing
- TFBGA
- Tg
- Thermal Conductivity
- Thermal Management
- Thermal Pad
- Thermal Relief
- Thermal Resistance
- Thermal Stability
- Thermal Stress
- Thermal Vias
- Thermistor
- Thermocouple
- Thermomechanical Analysis (TMA)
- Thermostat
- Thick Film
- Thick Film Capacitor
- Thick Film Resistor
- Thieving
- Thin Film
- Time Constant
- Time to Delamination
- TO Package
- Toggle Switch
- Tombstoning
- Top Side
- TPI
- TQFN
- TQFP
- Trace
- Track
- Transducer
- Transformer
- Transformer Coupling
- Transistor
- Transmission
- Transmission Line
- Transmitter
- Trapezoidal Apertures
- Triac
- Triangular Wave
- Trigger
- Trimmer
- TSOP
- TSQFP
- TSSOP
- Tube and Tray
- Turnkey
- Tweeze
- Twist
V
W